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Chemline launches hot-melt adhesives in pillow forms

Adhesives for hygienic and clean products
February 09, 2017 | By Mahan Hazarika

At PrintPack India, Chemline launched hot-melt adhesives for pressure-sensitive applications. “Chemline is a brand name and a brand has to be present at shows like PrintPack. So our objective was to make our presence felt in a big way here, in addition to meeting various customers at a single touch point. We have enhanced our brand name as well as launched some new products at the exhibition. Our objective of being in touch with machine manufacturers and potential customers have also been well achieved at the show,” said Ravindra Goel, managing director of Chemline.

  • Chemline launches hot-melt adhesives in pillow forms
  • Ravindra Goel, managing director of Chemline. Photo IPP

“In terms of new products, we have launched hot-melt adhesives in small pillow forms for pressure-sensitive applications. Pressure-sensitive hot-melt adhesives have applications in hygiene products, WPP bags and many more. Until now in India, hot-melt adhesives were available only in cake form,” he continued.

According to Goel, the main advantage of hot-melt adhesives in small pillow forms is that it melts far easily compared to hot-melt adhesives in large cake forms. Pillow form can increase the production speed as well as product quality to a significant level. Another advantage of the pillow form is that unlike cake forms, no human intervention is needed in the production as well as application level, which means better, hygienic and clean products. “We started manufacturing the pillow forms a month back, but it is at the exhibition that we are displaying it for the first time. We have received a very good response for this product,” shared Goel. At the exhibition, Chemline also launched a new grade of dry-lamination adhesive—the DL5000x25x—for metpet, which is comparatively more economical and offers higher mileage and better bonding.

  • Chemline launches hot-melt adhesives in pillow forms
  • Chemline's newly launched hot-melt adhesive in small pillow forms for pressure-sensitive applications. Photo IPP

Speaking about new trends, Goel said, “In packaging adhesives, water-based and solvent-based adhesives are gradually being replaced by hot-melt adhesives. Solvent-based adhesives lead to an increased level of pollution while water-based adhesives take a higher setting time. And this is the reason why we came up with a wide range of hot-melt adhesives.”


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